Spherical Alumina Pauda no nā mea i hoʻohālikelike ʻia i nā kiʻi

ʻO ka pauka alumina Spherical no nā mea pili wela

ʻO ka wehewehe pōkole:

Hana ʻia ka HRK series spherical alumina e ke ʻano hoʻoheheʻe kiʻekiʻe e hoʻomohala ana ma ke ʻano maʻamau ʻole ʻo Al2O3, a laila e hana i ka kānana, hoʻomaʻemaʻe a me nā kaʻina hana e loaʻa ai ka huahana hope.ʻO ka alumina i loaʻa he kiʻekiʻe spheroidization kiʻekiʻe, ka hoʻokaʻawale ʻana i ka nui o nā ʻāpana a me ka maʻemaʻe kiʻekiʻe.Ma muli o kāna mau waiwai kūikawā e like me ke kiʻekiʻe o ka thermal conductivity a me ka neʻe maikaʻi, ua hoʻohana nui ʻia ka huahana e like me ka hoʻopiha ʻana i nā mea pili wela, nā plastic engineering thermal a me nā Aluminum-based Copper-Clad Laminates a pēlā aku.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Hōʻike huahana

nui

SEM

Nā hiʻohiʻona huahana

Mea ʻenehana		Unite	Huahelu huahana HRK Series
Ka nui o ka ʻāpana			HRK-1	HRK-2	HRK-5	HRK-10	HRK-20	HRK-30	HRK-40	HRK-70	HRK-90	HRK-120
	(D10)	µm	0.71	0.69	2.54	4.55	10.5	16.88	23.77	44.32	55.23	92.39
	(D50)	µm	1.08	2.18	5.52	10.43	20.8	30.52	41.54	71.54	87.96	122.98
	(D90)	µm	3.21	5.24	9.09	20.8	37.24	48.87	66.44	106.5	134.92	172.07
Wahi Ili Pono		m2/g	1.69	1.27	0.36	0.17	0.14	0.13	0.12	0.12	0.1	0.06
Hoʻolima Uila		u S/cm	6.07	5.4	5.65	4.05	6.87	7.95	4.65	6.18	8.15	6.45
Waiwai PH		-	7.53	7.79	7.7	7.9	7.62	7.7	7.8	7.7	7.9	7.54
Māmā		%	0.05	0.03	0.03	0.03	0.03	0.03	0.03	0.03	0.03	0.04
ʻOiaʻiʻo Density		g/cm3	3.71	3.7	3.74	3.76	3.79	3.79	3.81	3.87	3.88	3.89
Ka helu Spheroidization		%	96	98	98	98	96	98	96	96	95	95
Hoʻohui Kimia	Al2O3	%	99.87	99.94	99.89	99.94	99.92	99.93	99.94	99.92	99.94	99.92
	SiO2	ppm	430	30	430	20	150	20	20	30	20	170
	Fe2O3	ppm	140	70	140	40	60	60	50	60	60	140
	Na2O	ppm	90	100	10	60	140	90	110	90	70	90

Palapala noi

● Mea Hoʻohui Thermal Interface: thermal silica pad, thermal grease, thermally conductive potting glue, mea hoʻololi ʻāpana;
● Thermally Conductive 'enekinia Plastics: LED uhi uhi, kuapo shell, uila huahana shell, uila huahana wela dissipation;
● Al-based Copper Clad Laminate: kiʻekiʻe-mana LED kaapuni substrate, mana kaapuni papa, etc;
● Nā kānana seramika alumina;
ʻO ka uhi ʻana i ka wela.