Huarui kiʻekiʻe wela nickel-based alloy IN625 pauka he optimized pauka, kūpono loa no ka SLM hana ʻenehana, me ka EOS Selective Laser Melting Equipment (EOSINT M Series), Concept Laser Melting Equipment, Renishaw Laser Melting Equipment, American 3D Systems Laser Melting Equipment, a me nā keʻena noiʻi kūloko a me nā kula.
Ma o ka mahele like ʻole o ka nui o ka ʻāpana, hiki ke hoʻokaʻawale ʻia i loko o ka pauka hoʻoheheʻe ʻia, ka pauka pale laser, ka pauka hoʻoheheʻe, ka pauka isostatic kaomi wela a pēlā aku.
Ka Hui Kemika(%) o Inconel 625 Pauka | ||||||
Cr | Co | Al | Mo | Mn | Ti | Nb |
20-23 | ≤1.0 | ≤0.4 | 8.0-10 | ≤0.5 | ≤0.4 | 3.15-4.15 |
Fe | C | Si | P | S | O | Ni |
≤0.5 | ≤0.1 | ≤0.5 | ≤0.015 | ≤0.15 | ≤0.02 | ʻO Bal |
ʻIke ʻia ke ʻano: 4.50g/cm3 | kala: hina | ʻAno: pōʻai | ||||
Ka nui o ka ʻāpana | 15-53micron;45-105micron;45-150micron |
ʻO Inconel 625 Nā Pono Pauda | ||||||
Lahi Nui | 0~25um | 0~45um | 15~45um | 45~105um | 75~180um | |
Morphology | Pōpoʻo | Pōpoʻo | Pōpoʻo | Pōpoʻo | Pōpoʻo | |
Puka Lahui | D10: 6um | D10: 9um | D10: 14um | D10: 53um | D10: 78um | |
D50:16um | D50: 28um | D50: 35um | D50: 69um | D50: 120um | ||
D90: 23um | D90: 39um | D90: 45um | D90: 95um | D90: 165um | ||
Hiki ke kahe | N/A | ≤30S | ≤28S | ≤16S | ≤18S | |
ʻIke ʻia ʻo Density | 4.2g/cm3 | 4.5g/cm3 | 4.4g/cm3 | 4.5g/cm3 | 4.4g/cm3 | |
Maʻiʻo Oxygen (wt%) | O: 0.06~0.018wt% , maʻamau ASTM: ≤0.02 wt% | |||||
3D paʻi ʻana i ka Gas Atomized Inconel 625 Powder me ke kumu kūʻai maikaʻi loa | ||||||
(ka oxygen haʻahaʻa, ka sphericity kiʻekiʻe a me ka wai maikaʻi) |
1. HVOF
2. Hoʻopili plasma
3. Paʻi 3D / hana hoʻohui
4. wili pauda
5. hoʻoheheʻe metala
6. isostatic wela
Hāʻawi pū mākou i ka pauka Inconel 718, ka pauka NiCr, ka pauka NiAl, ka pauka Ni20-Ni65, hoʻokipa i ka nīnau!