ʻO ka hale kūʻai hale kūʻai kālā i uhi ʻia i ka pauda keleawe Ag-Cu pauda

ʻO ka huahana he pauda maikaʻi kala-keleawe-ʻālohilohi me ka pili ikaika.ʻO ke kiʻekiʻe o ke kālā kālā, ʻoi aku ka maikaʻi o ka conductivity, a ʻo ke kala o ka huahana e pili kokoke ana i ke kālā maʻemaʻe.Hoʻohana ka hana i ka electroplating, ka mea e ʻoi aku ka paʻakikī o ka papa kālā a ʻoi aku ka maikaʻi o ka pale ʻana i ka oxidation;ʻoiai nā mea hana ʻē aʻe e hoʻohana i nā ʻano kemika, ʻo ka papa kālā he ʻino ka compactness a me ka pale ʻana i ka oxidation.Ma ke ʻano he pani o ka pauka kālā maʻemaʻe, hoʻohana ʻia ka pauda keleawe i uhi ʻia i ke kala i ka paʻi sintering, pena conductive, a me ka inika conductive.Ma waena o lākou, ʻo D50: 10um ka mea i hoʻohana nui ʻia i nā uhi conductive a me nā inika conductive.